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Figure 2 | Genome Biology

Figure 2

From: Insulator function and topological domain border strength scale with architectural protein occupancy

Figure 2

SMC-containing cohesin and condensin complexes localize to a subset of tDNAs and ETC loci. (a) Number of overlapping peaks identified by ChIP-seq against α-kleisen subunits Rad21 (cohesin), Barren (condensin I), and CAP-H2 (condensin II) in Kc167 cells (P < 0.00001 for overlap between Rad21 with CAP-H2 or Barren, permutation test). (b) Heatmap representation of ChIP-seq read intensities of SMC-containing complexes and TFIIIC subunit dTFIIIC220, anchored across all dTFIIIC220 peaks (top), plus or minus 5 kb. Heatmap representation (bottom) of overlap frequencies between dTFIIIC220 peaks and those of SMC-containing complexes (overlap significance for dTFIIIC220 with each factor P < 0.00001, permutation test). (c) Read intensity plots for Rad21, Barren, and CAP-H2 at TFIIIC-bound tDNAs (left) and ETC loci (right) plus or minus 5 kb. Tag density is represented as rank-order normalized reads per million (RPM) across all three ChIP-seq experiments. (d,e) Example genomics viewer profiles of overlapping dTFIIIC220 sites at tRNA genes and ETC loci. (f) Heatmap representation shown for DNase-seq and ChIP-seq read intensities at 1,311 active enhancers previously defined by STARR-seq, and marked by active enhancer characteristics in the Kc167 cell line, including DNase I hypersensitivity, H3K4me1 and H3K27ac. (g) Percentage of enhancers bound by dTFIIIC220 and SMC-containing complexes.

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